The Tropel FlatMaster® Wafer systems use a wide range of easy-to-load wafer chucks to allow clamped or free- state measurements. Windows®-based software simultaneously tests wafers to multiple user-definable global and local site flatness parameters. The continued demand for higher density chips with smaller critical dimensions leads to tighter substrate form tolerances both on the global and the individual die-site scale.

Learn more about the Tropel FlatMaster Wafer Form Analysis System.