The next generation of automated wafer qualification
The Corning Tropel Ultra Sort represents the state-of-the-art in automated semiconductor wafer measurement, and continues a 25-year tradition of providing metrology solutions to semiconductor manufacturers. Designed specifically for high volume wafer manufacturing, this automated system offers the utmost in rapid, repeatable, accurate non-contact verification of many substrate materials in the field.
The Tropel UltraSort includes cassette-to-cassette handling with user configurable sorting capability. This Class 100-compliant system integrated a grazing incidence interferometer with industry standard robotic wafer handling. It can measure wafer sizes from two to eight inches wide, and is well suited for a wide variety of materials including gallium arsenide, sapphire, quartz, germanium, silicon, and much more.
Browse our Catalog to learn more about the Tropel UltraSort and other metrology instruments.
|Accuracy||50 nm (2.0 u")|
|Repeatability||15 nm (0.6 u") 1 sigma|
|Resolution||5 nm (0.2 u")|
|Dynamic Range (typical, limited by surface slope)||> 100 um (0.004")|
|Part Range||50 mm - 200 mm (2" - 8")|
|Part Range Configuration||50 mm - 150 mm; 100 mm - 200 mm|
|Measured Data Points||~ 230,000 per measurement|
|Measurement Time||~ 5 seconds (typical)|
|Throughput = Clamped OR Unclamped||~ 120 wafers per hour|
|Throughput = Clamped AND Unclamped||~ 90 wafers per hour|
|Measurement Datums||Front referenced, back referenced, clamped, local site|
|Measurement Parameters||Bow, Warp, SORI, TTV, LTV, LDOF, Thickness, Stress, and others. Contact us for a complete list.|
|Data Analysis||3-D, Contour plot, 2-D slice plots, Histogram, and others. Contact us for a complete list.|
|Surfaces||Wire Sawn, ground, lapped, polished, etched|